THERMAL DRIFT COMPENSATION WITH ON-CHIP MEMS PIEZOELECTRIC CAPACITIVE ACCELEROMETER
Dr. Vijay Prakash Singh
Research Guide, Department of Electronics & Communication Engineering, School of Engineering, Sri Satya Sai University of Technology & Medical Sciences, Sehore, MP, India
Dr. Suneeta Kintali
Research Co-Guide, Department of Computer Science & Engineering, JB Institute of Engineering and Technology
Jupudi Vamsikrishna
Research Scholar, Department of Electronics & Communication Engineering, School of Engineering, Sri Satya Sai University of Technology & Medical Sciences, Sehore, MP, India
- ABSTRACT
The new advances in microelectronics innovation and the enormous development of the remote correspondence market have brought a lot of revenue into micro electro mechanical framework (MEMS) gadgets such as channels, oscillators, and switches. A scientific examination and a remuneration structure for temperature floats of predisposition and scale factor of a mass silicon MEMS capacitive accelerometer are introduced. The insightful model for the temperature float of inclination and temperature float of scale factor is set up dependent on the investigation results of warm twisting and firmness temperature reliance. Temperature drift is a key boundary influencing the general exhibition of high exactness and high security MEMS accelerometer. A three-dimensional design model of sandwich MEMS accelerometer made out of three distinct materials was set up utilizing limited component technique. At that point, warm mechanical coupling field investigation was performed dependent on the construction model, and the temperature float was quantitatively portrayed through separating the accelerometer’s differential capacitance variety and its pace of progress. The accelerometers with various degrees of flood are displayed by chip cement substrate models to examine the deformity of touchy segment actuated by temperature change.
Keywords: Micro Electro Mechanical Systems (MEMS), temperature drift, capacitive accelerometer.